1、nan ya cclccl technical dept., electronic materials div.nan ya plastics corporationtaiwannan ya cclenvironmental protectionsignal speed&integrityreliabilitysmaller form factorpcb techtrendsbuild up/hdiphosphorous freeimpedance controlnarrower linespacingflexibleembedded passiveshigh layer countlow d

2、k/low losshi tginsulationlow ctehalogen freelow water absorptioncaf-resistantlead free compatiblenp-200 (bt grade) np-180f (hi tg & low cte) np-175(f) np-155(f) np-170 np-150 np-140m(low tg/hi td) anti-caf materials high cti fr4 npg npgn-150npg-170npgn-170 npx-200 (for substrates) bendable ccl laser

3、 prepreg rcc2 mil & 3 mil coresultra thin glass yarn1037embedded capacitancenpldii & low dk glassnan ya ccltg tg by dsc suitable for lead free optional for lead free npg(halogen free)npg-200npg-170np-ldii np-175/fnp-170np-155/fnp-150fr-4 d/s200npg-180 high tg(h.f) high layer count mlb ic substratenp

4、-200bt laminate ic substrates bt laminate (h.f) ic substrate np-180/ffr-5 gradehigh layer count mlb ic substraterccfr-4 gradehigh layer count mlb high tg (h.f) high layer count mlbhigh performance fr-4 special applicationfr-4-86 uvfr-4-98 cti 600npgnpgn-150 halogen free fr-4np-140mnp-140fr-4 tetra-f

5、unctional for mlb180cem-3cem-1cem-3-86/cem-3-01 halogen freecem-1-87/ cem-1-97 cti600laser pp laser drillable prepreg for hdi175150140135130low dk/dfhigh frequency/low loss resin coated copper for hdi180180o o o o o onan ya cclnp-180rcclaser p.p移動電話移動電話hdi產品產品cem-1cem-3電源供應器，監視電源供應器，監視器，電視游戲器，電視游戲np

6、-140mnp-140個人電腦個人電腦, 筆記本筆記本電腦電腦,個人電腦外個人電腦外設設fr-4 個人電腦個人電腦, 筆記本筆記本電腦電腦 ,個人電腦外個人電腦外設設np-155(f)np-150個人電腦個人電腦,筆記本筆記本電腦電腦 pcmciapcmcia卡卡npgnnpg個人電腦個人電腦& 筆記本筆記本電腦磁盤驅動器電腦磁盤驅動器npg-180bga, csp, 網絡服務器網絡服務器 np-200bga, cspbga, cspnpg-200np-ld基站基站np-175(f)np-170通信服務器通信服務器bga, csp, 汽車網絡服務器汽車網絡服務器nan ya ccl無鉛組裝之焊

7、錫材料熔點更高無鉛組裝之焊錫材料熔點更高回流焊過程有更高的溫度曲線回流焊過程有更高的溫度曲線焊錫類型焊錫類型熔點熔點()()i.r i.r 最高溫度最高溫度（) )高溫高溫. .snsn-ag-cu-ag-cu(96.5 3 0.3)(96.5 3 0.3)217217220220245245260260較高溫度較高溫度. .sn-ag-cu-sn-ag-cu-bi(inbi(in) )210210220220235235245245一般一般pb-snpb-sn(33 67)(33 67)183183225225230230nan ya ccl soak time ramp-up rate l

8、ead free reflow (snagcu) tin/lead(63/37) reflow t:30-44t:20-30peak temptime above liquidus(tal)500100150200250melting point lf melting pointnan ya cclnp-150np-200np-180tg()np-140200180175150140bt laminatefr-5 grademedium tg fr-4 fr-4np-180(f) np-175 np-175f np-155 np-155fhigh thermal stability mater

9、ialnp-170high tg fr-4nan ya ccl np-140np170np140mnp-155fnp-175fthickness (mm)1.61.61,61.61.6dsc tg135171 135 155170peel strength (1oz)12.510.511.59.59.51/2hr pct moisture0.226%0.190.2100.15%0.147%1/2hr pct+288solder dipping330”430”10”1010z-axis 1/ ppm/67.1606548.349.5z-axis 2/ ppm/288.0285289256.525

10、9.7cte 50-260 %4.33.74.33.33.1t-288 delamination 2.07 min255min 30 min 30 mint-260 delamination25.03 min253030min60 min60 mintga td (on set)309.2311 323.5 357359tga 5% wt loss311.3312.2 325.9 360361fr-4, np-155f,np-175f 特性比對特性比對nan ya cclipc 規范規范 vs nan ya 材料材料nan ya cclitemfr4npgnpgn-150npg-170npgn

11、-170npg-180npg-200resin systembr. epoxyhalogen freehalogen freehalogen freehalogen freehalogen freehalogen freecuring agentdicydicy non dicydicynon dicynon dicynon dicytg (,dsc)140150145(tma)170170190(dma)205(dma)cte (%, 50250)4.12.42.42.32.42.22.0t-260 (min)25606060606060t-288 (min)25205204040td (,

12、tga)310350360359360367370dk (1ghz)4.504.604.504.604.534.824.40df (1ghz)0.0160.0120.0130.0120.0130.0150.013rigid construction: 4 ply 7628npg: “g” for green (hf) materials南亞各系列無鹵材料特性南亞各系列無鹵材料特性比較比較nan ya cclhats冷熱沖擊測試結果冷熱沖擊測試結果materiala conditionpre-condition245 reflowx6pre-condition 260 reflowx6一般材料一

13、般材料162-247150-266142-227mid-tg pn +填充材填充材10001000800-900hi-tgpn +填充材填充材100010001000無鹵材料無鹵材料100010001000test condition:-40-145 /1000 cyclessample:12-layer test vehiclenan ya ccl熱膨脹特性熱膨脹特性expansion, ppm/一般材料一般材料pn fr4+填充材填充材hi tg無鹵材料無鹵材料x-ctey-cte151815181315131511131113z-cte, before tgz-cte, after tg

14、582874526035.3210nan ya ccl線路板加工之影響一般材料一般材料無鹵材料無鹵材料鉆孔鉆孔2,000鉆鉆1,500鉆鉆除渣除渣ok需調整制程條件需調整制程條件黑棕化藥水黑棕化藥水ok接著力較低接著力較低 壓合壓合操作空間操作空間較較廣廣需調整制程條件需調整制程條件印刷線路板加工條件之建議印刷線路板加工條件之建議nan ya ccl鉆孔條件鉆孔條件machine hole sizspeedinfeedrtrthkpnl/stsckschmoll lz0.30mm160 kr/min134 ipm437 ipm1.62 ply鉆頭磨損比較鉆頭磨損比較1000 hit2000 h

15、it3000 hit total (48000 hit)npg 24.46%30.72%36.52%30.56%npgn-15025.28%27.32%32.93%28.51% npg&npgn-150鑽孔比對測試鑽孔比對測試nan ya ccl鉆鉆孔精度孔精度比較比較npgnpgn-150cp/cpk1.334/0.7851.859/1.204target ( 2.0 mil )1325/48098660/481042.75%1.37%nan ya ccl鉆頭磨耗比較鉆頭磨耗比較新新鉆頭鉆頭 fr4pn+填充材填充材無鹵材料無鹵材料條件條件rpm:200kipm:114.2hits:3500

16、hole size:10 milnan ya cclmaterial typesblack oxidebrown oxidechemical abcdstandard fr44.933.854.563.57npg3.233.123.012.74npgn-1503.693.463.593.12unit: lb/innan ya ccl無鹵材性能比較表無鹵材性能比較表-cclnan ya cclnpg(dicy)npgn-150(pn)pcblayer10l14lthicknessmm1.8-2.02.4-2.5dsc-tg 155150.6288 solder floating 10”-6 cy

17、cles10 cycles260 ir reflow cycles-6-7 cycles10 cyclest-260min8.5824.06t-288min2.258.68pcblayer2+4+23+2+3thicknessmm1.00.8dsc-tg 156.8150.5260 ir reflow cycles-10-1215t-260min25.42-t-288min2-530無鹵材性能比較表無鹵材性能比較表-pcbnan ya cclproductsapplicationspc-desktop (4-layer motherboard)mobile pc-notebook (810-layer)mobile phone (48-layer)lcd tv (4-layer motherboard)hard disk-hdd (4-layer motherboard)basestation (12-layer;nordic brandname)network basestation (14-layer;nordic