MLK029AisasmallsizeandlowprofileofWiFi+BTcombomoduleLGA(Land-GridArray)footprint,boardsizeis20mm*10mmwithmoduleheight2mm.ItcanbeeasilymanufacturedonSMTprocessandhighlysuitablefortabletPC,ultrabook, deviceandconsumerproduct.ItprovidesGSPI/SDIOinterfaceforWiFitoconnectwithhostprocessorandhighspeedUARTinterfaceforBT.ItalsohasaPCMinterfaceforaudiodatatransmissionwithdirectlinktoexternalaudiocodecviaBTcontroller.TheWiFithroughputcangoupto150Mbpsintheorybyusing1x1802.11nb/g/nMIMOtechnologyandBluetoothcansupportBT2.1+EDR/BT3.0andBT4.0.RF-SM02usesRealtekRTL8723AS,ahighlyintegratedWiFi/BTchipbasedonadvancedCOMSprocess.RTL8723ASalmostintegrateswholeWiFi/BTfunctionblocksintoachip,suchasSDIO/UART,MAC,BB,AFE,RFE,PA,EEPROMandLDO/SWR,exceptfewerpassivecomponentsremainedonPRODUCTOperateatISMfrequencybandsGSPI/SDIOforWiFiandUARTforIEEEstandardssupport:IEEE802.11b,IEEE802.11g,IEEE802.11n,IEEE802.11d,IEEE802.11e,IEEE802.11h,IEEE802.11iFullyQualifiedBluetooth2.1+EDRspecificationincludingboth2Mbpsand3MbpsmodulationmodeFullyqualifiedBluetoothFullyqualifiedBluetooth4.0DualFull–speedBluetoothoperationwithPiconetandScatternetEnterpriselevelsecuritywhichcan 2certificationforWiFi1transmitterand1receiverallowdataratessupportingupto150Mbpsdownstreamand150MbpsupstreamPHYratesSupportsophisticatedWiFi/BTcoexistencemechanismtoenhancecollocationperformanceSupportantennadiversityforWiFiandBTantennaSupportBluetoothadaptivepowermanagementFull-featuredsoftwareutilityforeasyconfigurationandRoHSLowHalogenMT5931providesthebestandmostconvenientconnectivityfunctions.MTK5931implementsadvancedandsophisticatedradiocoexistencealgorithmsandhardwaremechanisms.Theenhancedoverallqualityforsimultaneousvoice,data,andaudio/transmissiononphoneandTabletPCcanbeachieved.ThesmallpackagesizewithlowpowerconsumptionreducesthePCBlayoutarea.PRODUCTEmbeddedRISCcoreforbettersystemlevelCoexistence:IEEE802.15.2externalthree-wirecoexistenceschemetosupportwirelesssuchas3G,GPSand_SelfIntegratedswitchingregulatorenablesdirectconnectiontobattery.Best-in-classcurrentconsumptionperformance ligentBT/WLANcoexistenceschemethatgoesbeyondPTAsignaling(forexample,transmitwindowanddurationthattakeintoaccountofprotocolexchangesequence,frequency,etc.)TFBGA(5.1x5.3mm2)2.4GHzsinglestream802.11b/g/n802.11d/h/kSecurity:WFA al,WPS2.0,WAPI(hardware)QoS:WFAWMM,WMMPSSupports802.11noptionalfeatures:STBC,A-MPDU,Blk-Ack,RIFS,MCSFeedback,20/40MHzcoexistence(PCO),unscheduledPSMPSupports802.11wprotectedmanagedframesSupportsWi-FiDirectInterface:SDIO2.0(4-bit&1-bit)PerpacketTxpowercontrolPRODUCTBlockGeneralModelMLK-SDIOWIFIWLANIEEE802.11b/g/n,Wi-FiHostMajorRalink PCB15mmX Operating90%RHnon-condensing(12monthsNon-0~40℃ElectricalSpread300m(Thetransmissionspeedmayvaryaccordingthe11n:Data11b:11g:Transmit150M:-135M:-54M:-11M:-6M:-1M:-Data -2-StorageTemperature:-40~70℃(-40℉~158℉Non-StorageNon-OFDM/CCK/16-QAM/64-Window98,ME,SE,XP,XP-Windows7，32/64,Power3.3VSupplyVMechanicalPin123456789TESTTestTXFreqRX ---mendedReflow貼片WIFI模塊裝機的前注意事A、客戶在開鋼網時一定要將WIFI模塊焊盤的孔開大，請按1比10.7Mm比例來開，厚度按0.12MmB、WIFI模塊在上線貼片前建議烘烤12小時以上，溫度在120度+-5D、有需要拿WIFI模時一定不要光著