1、PCB專業(yè)英語What is PCB? Printed Circuit BoardPCB Effect？Conduct ElectricityTransmission SignelSupported Fixation Action前言Foreword（印刷線路板）（導(dǎo)電）（傳輸信號(hào)）（支撐固定）PCB Sort分類A:Single-sidedDouble- sidedMulti-layer Printed Circuit Board (PCB)B:Rigid PCB Flexible PCB Flex-rigid PCB單面/雙面/多層PCB剛性/撓性/剛撓性PCBPCB Sort分類meta

2、lbasePCB(金屬基板)Blindboard(盲孔板)buriedboard(埋孔板)bareboard(裸板)Quickturnprototype(樣板)LaminateCut (開料)Inner Dry Film (內(nèi)層菲林)Inner Etching內(nèi)層蝕刻Black Oxide 黑化Brown Oxidation棕化Laminating層壓Drilling鉆 孔Plated-through hole沉銅Outer Dry Film外層干膜Pattern Plating圖形電鍍 Outer Etching外層蝕刻 Wet Film 阻焊 Silk Screen綱版印刷字符 Surfa

3、ce Treatment表面處理 Golden Finger 鍍金手指 Hot Air Leveling噴錫 Routing外形 E-test （電子測(cè)試 ) Packing包裝 Output 出 貨 二、Process Flow 工藝流程 Inner Dry FilmInner Etching內(nèi)層菲林Outer Dry Film 外層菲林 內(nèi)層蝕刻outer Etching 外層蝕刻Inner Inspection 內(nèi)檢Outer Inspection 外檢層壓 LALaminate DR BO棕/黑氧化Brown/Black Oxidation鉆 孔Drilling PTH PP WF 沉

4、銅 Plated-through hole 圖形電鍍 阻焊Pattern PlatingWet FilmEngineering Common words 常用詞語Base MaterialCoppercladlaminate(CCL)(覆銅板)PREPREG(半固化片)Epoxyresin(環(huán)氧樹脂)Copperfoil(銅箔)Dielecteics(介質(zhì))PTFE(Polytetralluoetylene)Teflon(聚四氟乙烯)dielectricconstant（介電常數(shù)）Engineering Common words 常用詞語Soldermask(阻焊)Dryfilm（干膜）leg

5、endink(字符油墨)peelablesolder mask(可剝離阻焊)Engineering Common words 常用詞語Surface Treatment沉金Immersion GoldChemical GoldEnectroless Gold PlatingENIG= Enectroless Nickel and Immersion GoldEngineering Common words 常用詞語電鍍金Gold platingElectric Gold platingHard Gold Plating無鉛噴錫Lead Free HASLHASL for Pb FreeSN10

6、0CEngineering Common words 常用詞語噴錫HAL=Hot Air LevelingHASL=Hot Air Solder LevelingSn/Pb(63/36)Tin/Lead solderEngineering Common words 常用詞語金手指Gold FingersEdge Connector PlatingTabconnector Chamfer(倒角)橋連Bridge ConnectingTab ConnectingEngineering Common words 常用詞語橋連郵票孔Connecting tabs with Stamp holesCon

7、necting tabs with Mouse(Mice) Bite holes工藝邊Rails(Tooling Rails)Tooling StripEngineering Common words 常用詞語Panel FrameHolding FrameWaste EdgeBurr(毛刺)Twist and Warp(翹曲) Common words 常用詞語檢驗(yàn)FinalInspection(終檢) Fibreexposure(漏基材)Holebreakout(破孔)Thermalshock(熱沖擊)Thermalstress(熱應(yīng)力)Reworking(返工) Overetching(

8、過蝕) Common words 常用詞語Majorequipments Laserplotter(激光光繪機(jī)) CNCrouting machine(數(shù)控銑床)Patternplatingline(圖形電鍍線)Dryfilmlaminator（貼膜機(jī)） Exposuredevelopingline (曝光顯影線)FlyingProbetestFPT（飛針檢測(cè)儀）Automaticoptical instrumentAOI (自動(dòng)光學(xué)檢測(cè)儀) EngineeringDesign tearpad(淚滴焊盤)isolation pad(隔離焊盤)thermalpad(熱焊盤)mountinghol

9、e(安裝孔)Fiducial Mark(基準(zhǔn)點(diǎn)、反光點(diǎn)) ComponentAssembly （元器件組裝） SMT(Surfacemounttechnology)(表面貼裝技術(shù))Bonding(邦定)BGA(ballgridarray)(球柵封裝)SMD(Surfacemountdevices)(表面貼裝設(shè)備)Placementmachine(貼裝機(jī))REFOLWSOLDERING(回流焊)WAVESOLDERING(波峰焊) ExampleADD 4 TOOLING HOLES IN EACH OF THE CORNERS OF THE PANEL FRAME.THE DIAMETER O

10、F EACH TOOLING HOLE SHOULD BE 3.5MM. EACH TOOLING HOLE SHOULD BE PLACED Y=2.5MM AND X=2.5MM FROM THE CORNERS OF THE PANELFRAME. THE PANEL FRAME HAS A WIDTH OF 5MM AND SHOULD ONLY EXIST ON 2 SIDES OF THE PANEL. 拼版后加2 個(gè)寬5MM 的附邊，在拼版附邊上的4 角加4 個(gè)定位孔，直徑3.5MM，X，Y 方向分別離附邊 2.5MM Example6 LAYER PCB , 1.60 MM T

11、HICK FR4 ,2 X GREEN SOLDER MASKS , 2 X WHITE OVERLAYS , UL IS REQUIRED , PCBS TO BE BARE BOARD TESTED , PANEL ROUTED , PCB SIZE : 265 X 356 MM QUANTITY IS PER PCB , 10 OFF PCBS REQUIRED , IMMERSION SILVER 6 層板，1.6MM 厚，F(xiàn)R-4 板材，兩層綠色阻焊，兩層白色字符，UL 標(biāo)記要加，做裸板測(cè)試，拼版銑外形，板尺寸：265 X 356 MM，交貨數(shù)量 10 個(gè),沉銀 處理習(xí)慣對(duì)于外銷客戶，客戶在回復(fù)工程問題后，會(huì)問道Please confirm all the questions are clear and the order could be proceeded ?/Please feedback if you could understand all the comment above?我們?cè)谔幚砉こ虇栴}后，正確禮