1、印制電路詞匯1. 綜合詞匯Printed circuit印制電路Printed wiring印制線路Printed circuit board印制電路板Printed wiring board印制線路板Printed component印制元件Printed contact印制接點Single-sided printed circuit board (SSB)單面印制電路板double-sided printedcircuit board (DSB)雙面印制電路板Multilayer printed circuit board (MLB)多層印制電路板Rigid printed circuit

2、 board剛性印制電路板Flexible printed circuit board撓性印制電路板Flex-rigid printed circuit board剛撓結合印制電路板Build-up printed board積層印制板Surface laminar circuit (SLC)表面層合電路板Build-up multilayer printed Board (BUM)積層多層印制板Metal base printed board金屬基印制板B2it printed board埋入凸塊互連印制板ALIVH Multilayer printed board層間全內導通多層印制板Ch

3、ip on board (COB)載芯片板Backplane背板Bare board裸板Break-away panel可斷拼板Interconnection互連Conductor trace line導線Substrate基底Real estate基板面Conductor side導線面Component side元件面Solder side焊接面Printing印制grid網格pattern圖形Conductive pattern導電圖形Non- conductive pattern非導電圖形Legend字符Mark標志2 基材2.1 基材的種類和結構Base material基材Lami

4、nate層壓板Copper-clad laminate (CCL)覆銅箔層壓板Prepreg預浸材料Bonding sheet粘結片bonding layer粘結層Preimpregnated bonding sheet預浸粘結片Epoxy glass substrate環氧玻璃基板Copper-clad surface銅箔面Foil removal surface去銅箔面Length wise direction縱向cross wise direction橫向Core material內層芯材UV blocking copper-clad laminates紫外光阻擋型覆銅箔板2.2 基材的

5、材料A-stage resinA 階樹脂B-stage resinB 階樹脂C -stage resinC 階樹脂epoxy resin環氧樹脂Polymer聚合物Photosensitive resin感光性樹脂Thermosetting resin熱固性樹脂Thermoplastic resin熱塑性樹脂Adhesive膠粘劑Curing agent固化劑Flame retardant阻燃劑opaquer遮光劑Polyester film (PET)聚酯薄膜Polyimide film (PI)聚酰亞胺薄膜Polytetrafluoroethylene (PTFE)聚四氟乙烯Non-wov

6、en fabric非織布/無紡布Glass fiber玻璃纖維Glass fabric玻璃布Warp-wise經向Weft-wise緯向Copper foil銅箔Electrodeposited copper foil電解銅箔Rolled copper foil壓延銅箔Resin coated copper foil (RCC)涂樹脂銅箔Reversed Treatment Foil翻轉處理銅箔Double Treated Foil 雙面處理銅箔Drum Side/shiny side（銅箔）光面Matte Side（銅箔）毛面2.3 基材的制

7、造Polymerize聚合Thermoplastic熱塑性Thermoset熱固性creep蠕變Gel凝膠體Clad覆箔Layup疊層laminating層壓/復合Internal identification mark內部識別標志Post cure后固化Gel time凝膠時間Curing time固化時間Resin flow樹脂流動度Resin content樹脂含量3 設計3.1 通用術語Computer-aided design (CAD)計算機輔助設計Computer-aided manufacturing (CAM)計算機輔助制造Routing布線Layout布圖設計Compone

8、nt density元件密度Array陣列3.2 形狀與尺寸Conductor導線Conductor width導線寬度Conductor spacing導線間距Conductor line/space導線寬度/間距Conductor layer導線層Teardrop pad淚滴盤Isolation pad隔離盤Offset land偏置連接盤(焊盤)Annular ring孔環Component hole元件孔Mounting hole安裝孔Supported hole支撐孔Unsupported hole非支撐孔Via導通孔Plated through hole鍍通孔Blind via (

9、hole)盲孔Buried via (hole)埋孔Buried/ blind via埋/盲孔Any layer inner via hole (ALIVH)任意層內部導通孔Tooling/ pilot hole定位孔Landless via hole無連接盤導通孔Via-in-pad在連接盤中導通孔Pitch節距Fine pitch精細節距Ground plane接地層Voltage/power/bus plane電壓/電源層Register mark對準標記3.3 電氣互連Interfacial connection表面間連接Interlayer connection層間連接Innerla

10、yer connection內層連接Pad, land連接盤、焊盤、焊環Component lead元件引腳3.4其他Primary side主面Secondary side輔面Signal layer信號層Crosstalk串擾Capacitance電容Impedance特性阻抗Impedance match阻抗匹配Electromagnetic shielding電磁屏蔽Electromagnetic compatibility（EMC）電磁兼容Electromagnetic interference (EMT)電磁干擾Inductance電感Coplanarity共面性（度）Core b

11、oard 芯板Thin type multilayer board薄型多層板Buried and blind via hole multilayer board埋/盲孔多層板Buried bump interconnection technology (B2it)嵌入凸塊互連技術Multichip module (MCM)多芯片模塊Alignment mark對準標記Fiducial mark基準標記Registration mark對位標記Layer to layer registration層間重合度4. 制造4.1 通用術語Subtractive process減成法Additive p

12、rocess加成法Semi-additive process半加成法Full-additive process全加成法Build up process積層法Solder mask on bare copper (SMOBC)裸銅覆阻焊工藝Tenting掩蔽法Sequential lamination順序層壓法Wet process濕處理Panel plating process板面電鍍法Pattern plating process圖形電鍍法Finishing最終修飾Reworking返工Tooling feature工藝標識Panel在制板，拼板First article首板Prototyp

13、e試樣板End product最終產品Process flow工藝流程Process window工藝范圍Lot size批量Job traveler工作流程單4.2 照相底版制作Artwork照相底圖Phototool照相底版Artwork master照相原版Working master工作原版Production master生產底版Photographic film照相底片Silver film銀鹽底片Diazo film重氮底片Positive正像Positive pattern正像圖形Negative負像Negative pattern負像圖形Photo plotting光繪圖La

14、ser plotting激光繪圖Gerber fileGerber文件Photoplotter光繪機Laser plotter激光繪圖機Registration mark定位標記4.3 圖形轉移Printing ink印料Etching resist ink抗蝕印料Plating resist ink耐電鍍印料Resist抗蝕劑Photo resist光致抗蝕劑Dry film photoresist干膜光致抗蝕劑Liquid photoresist液體光致抗蝕劑Positive-acting resist正性抗蝕劑Negative- acting resist負性抗蝕劑Plating res

15、ist耐電鍍抗蝕劑Plated resist抗蝕鍍層Permanent resist永久性保護層Electro-deposited photoresist電沉積光致抗蝕劑Mask掩膜Solder resist、solder mask阻焊劑Solder mask ink阻焊印料Dry film solder mask阻焊干膜Liquid photosensitive solder resist液體光致阻焊劑Marking ink、legend ink標記印料Conductive paste導電膏Hole filing ink堵孔油墨Peelable solder mask ink 可剝性防焊油墨

16、Thermally curable、heat cured熱固化Ultraviolet curable (UV cured)紫外線固化Screen printing網版印刷Silk screen絲印網版Stencil網版Screenability網印能力Chase、frame網框Fabric、cloth絲網Mesh count網目數Squeegee刮板Skip printing漏印Thinner、diluent稀釋劑Viscosity粘度Imaging成像Imaging transfer圖像轉移Dry film imaging干膜制圖形Lamination貼膜Wet lamination濕法貼膜

17、Exposure曝光holding time停留時間developing顯影developer顯影液anti-foamer/ anti-foaming agent消泡劑resolution分辨率definition逼真度ghost image重影halation暈環air inclusion夾雜氣泡tackiness粘著性post cure后固化shelf life保存期pot life/ working life適用期/工作壽命dip coating浸涂法roller coating輥涂法spray coating噴涂法curtain coating簾幕法laser direct imagi

18、ng激光直接成像4.4清洗與蝕刻rinsing / rinse水洗electrolytic cleaning電解清洗alkaline degreasing化學除油electrolytic degreasing電解除油overflow溢流deionized water去離子水surface active agent /surfactant表面活性劑surface tension表面張力wetting潤濕wetting agent / wetter潤濕劑tarnish污化drag in/ drag out帶進/帶出brushing / scrubbing磨刷abrasive磨料scrubber磨刷

19、機mechanical cleaning機械清洗chemical clearing化學清洗pumice powder浮石粉/火山灰sand blasting噴砂deburring去披峰/去毛刺mechanical polishing機械拋光chemical polishing化學拋光electropolishing電拋光etchant蝕刻劑/蝕刻液Undercut側蝕microetch微蝕over etching過腐蝕stripper剝離液bright dip浸亮4.5 電鍍和涂覆Plating鍍覆electrochemistry電化學electrolyte電解質electrolytic so

20、lution電解液electrochemical corrosion電化學腐蝕chemical corrosion化學腐蝕ionization電離migration遷移solubility溶解度addition agent/additive添加劑Galvanic cell原電池Throwing power分散能力brightening agent/brightener光亮劑leveling agent整平劑catalyst/catalyzer催化劑activator/activating agent活化劑acceleration agent/accelerator增速劑chelating ag

21、ent/chelant螯合劑complex絡和物swelling agent/sweller膨松劑plasma等離子體electroplating電鍍metal electrodeposition金屬電沉積bright plating光亮電鍍alloy plating合金電鍍strik plating沖擊鍍flash/flash plating閃鍍pulse plating脈沖電鍍rack plating掛鍍barrel plating滾鍍brush plating刷鍍selective plating選擇性電鍍Auxiliary anode輔助陽極Auxiliary cathode輔助陰極P

22、replating鍍前處理Postplating鍍后處理Plating up電鍍加厚Pattern plating圖形電鍍Panel plating整板電鍍Copper (electro) plating電鍍銅Tin-lead plating電鍍錫鉛Plating line電鍍線Electroless plating,electroless deposition無電電鍍Immersion plate浸鍍Plated through hole（PTH）孔金屬化Electroless copper plating化學沉銅Direct plating直接電鍍Roughening粗化Sensitiza

23、tion敏化Catalyzing催化Metallization金屬化Acceleration增速Chemisorption化學吸附Swelling溶脹Hole conditioning整孔Hole cleaning洗孔Desmear, smear removal去鉆污Etchback凹蝕Plasma desmear等離子去鉆污passivation鈍化acid dipping弱浸蝕pickling強浸蝕hot melting熱熔fusing fluid熱熔液solder leveling焊料整平tin immersion浸錫solder焊錫solder coat焊錫涂層flux助焊劑prefl

24、ux預焊劑organic solderabilitypreservatives (OSP)有機保護劑black oxidation黑氧化brown oxidation棕氧化Pink ring粉紅圈（環）pits麻點peeling起皮blister起泡orange peel 桔皮pores針孔porosity孔隙率hardness硬度tarnish金屬變色4.6機械加工和壓制drilling鉆孔numerical control (NC)數控back-up墊板entry material蓋板spindle主軸ring / collar鉆套feed rate進給速率off set鉆面不勻resin

25、 smear樹脂鉆污foil burr銅箔毛刺break-out破出hole counter數孔機laser via hole激光鉆孔photo via hole光致穿孔plasma via hole等離子穿孔counterboring沉頭孔（埋頭孔）countersinking錐形孔platen熱壓板opening/daylight開檔press plate壓模板bonding layer / bonding sheet粘結層kraft paper牛皮紙lamination void層間空洞dent凹坑crease皺褶punching沖切bugle hole喇叭孔die 沖模shearing

26、 / cutting切料routing銑切bevelling倒斜邊chamfer倒角scoring刻槽V cut槽切割Sewing hole縫紉孔Fixture夾具Indexing hole基準孔Tooling feature定位特征5檢測5.1 通用術語inspection檢驗test試驗as received驗收態production board成品板test board測試板coupon附連板qualification testing鑒定試驗acceptance tests驗收試驗accelerated test加速試驗aging老化quality conformance testing

27、質量一致性試驗storage life貯存期specification規范standard標準tolerance容差/公差nonconformity不合格nonconforming item (unit)不合格品defect缺陷sampling inspection抽樣檢驗acceptable quality level (AQL)可接收質量水平5.2外觀和尺寸visual examination/visual inspection目檢blister起泡blow hole氣孔bulge凸起cracking裂縫crazing微裂紋burr毛刺dishdown凹陷measling白斑delamin

28、ation分層fibre exposure露纖維Weave exposure露織物dent / indentation壓痕haloing暈圈wrinkle 皺褶void空洞hole breakout破環foreign material（基材內）外來物hole void孔壁空洞nail heading釘頭lifted land連接盤起翹nodule結瘤nick缺口pit麻點pin hole針孔scratch劃痕resin recession樹脂凹縮laminate void層壓空洞bump凸瘤shadowing / etchback凹蝕陰影mealing粉點Wedge void楔形空洞5.3 電

29、性能Surface insulation resistance (SIR)表明絕緣電阻Dielectric constant介電常數permittivity電容率；介電常數Dielectric dissipation factor損耗因數Dielectric strength介電強度Dielectric breakdown介電擊穿Dielectric withstanding voltage耐電壓Metal migration金屬遷移Electro migration電遷移Known good board (KGB)已知好板5.4 非電性能Bond strength粘合強度Pull-off s

30、trength拉脫強度Pull-out strength拉出強度Pull strength拉離強度Peel strength剝離強度Flexural strength彎曲強度Tensile strength拉伸強度Shear strength剪切強度Torsional strength抗扭強度Hole pull strength孔拉脫強度Pull away拉離Tear strength撕裂強度Bow弓曲Twist扭曲Coefficient of thermalexpansion (CTE)熱膨脹系數Dimensional stability尺寸穩定性Machinability機械加工性Heat

31、 resistance耐熱性Thermal stress熱應力Thermal shock熱沖擊elongation伸長率Solder float test浮焊試驗Substrate bending test基板彎曲試驗Bendability彎曲能力Fatigue life疲勞壽命Fatigue limit疲勞極限Fatigue strength疲勞強度Abrasion resistance耐磨(擦)性Wear resistance耐磨(損)性Crease褶痕Solderability可焊性Wetting焊料潤濕Dewetting半潤濕Nonwetting不潤濕Microsectioning顯微

32、剖切Porosity test孔隙率試驗Cleanliness清潔度Ionic cleanliness離子清潔度Ionizable contaminant離子污染Nonionic contaminant非離子污染Organic contamination有機污染Outgassing排氣Self-extinguishing自熄性Chemical resistance耐化學性bleeding滲出Glass transition temperature玻璃化溫度Differential scanning calorimetry差示掃描量熱法Thermal mechanical analysis熱機械

33、分析6. 組裝surface mount technology (SMT)表面組裝技術surface mount component (SMC)表面組裝元件chip scale package (CSP) / chip scale mounting芯片級組裝flip chip package (FCP)倒芯片封裝soldering焊接reflow soldering再流焊；回流焊wave soldering波峰焊assembly density組裝密度lead引線lead foot / lead引腳（腿）lead pitch引腳節距fine pitch devices (FPD)精細節距器件n

34、ode連接節點chip carrier芯片載體ball grid array (BGA)球柵陣列chip / die / dice裸芯片flip chip倒裝芯片active devices (parts)有源器件passive devices (parts)無源器件embedded component埋入元件add-on component附加元件integrated circuit (IC)集成電路resin flux樹脂（松香）助焊劑bond焊（連）接electrical bridging電橋接dross焊渣residue 殘留物stress relief消除應力7.光電路optical

35、 board光線路板optical daughter board光插板、光子板optical pig tail光抽頭、光引出端fiber flexible optical board光纖撓性線路板diffusion optical transmission擴散光傳輸印制電路技術英語縮略語ALIVH (any layer inner via hole)任意層內部導通孔AOI (automatic optical inspection)自動光學檢驗BGA (ball grill array)球柵陣列BUM (build-up multilayer)積層多層（板）BUT (build-up tech

36、nology)積層式技術CAD(computer aided design)計算機輔助設計CAM (computer aided manufacturing)計算機輔助制造CAF(conductive anodic filament)陽極導電細絲CCL (copper clad laminate)覆銅箔層壓板CMT (chip mount technology)芯片安裝技術CNC (computer numerical control)計算機數字控制COB (chip-on-board)載芯片板CPCA (China Printed Circuit Association)中國印制電路行業協會CSP (chip scale packaging)芯片級封裝DI (direct imaging)直接成像法DIW