1、PCB Engineering Report Sheet0印刷電路板制程介紹印刷電路板制程介紹PCB Engineering Report Sheet1Flow Chart of PCB ProcessFlow Chart of PCB ProcessPCB Engineering Report Sheet2( 1 ) 前前 制制 程程 治治 工工 具具 制制 作作 流流 程程顧 客CUSTOMER裁 板LAMINATE SHEAR業(yè) 務(wù)SALES DEP.生 產(chǎn) 管 理P&M CONTROLMASTER A/W底 片DISK , M/T磁 片磁 帶藍(lán) 圖DRAWING數(shù)據(jù)傳送MODE

2、M , FTP網(wǎng)版制作STENCILDRAWING圖 面RUN CARD制作規(guī) 范PROGRAM程 式 帶鉆孔,成型機(jī)D. N. C.工 程 制 前FRONT-END DEP.工作底片WORKING A/WPCB Engineering Report Sheet3( 2 ) 多多 層層 板板 內(nèi)內(nèi) 層層 制制 作作 流流 程程曝 光EXPOSURE壓 膜LAMINATION前 處 理PRELIMINARYTREATMENT去 膜STRIPPING蝕 銅ETCHING顯 影DEVELOPING黑化處理BLACK OXIDE烘 烤BAKINGLAY- UP及預(yù)迭板迭板后 處 理POST TREAT

3、MENT壓 合LAMINATION內(nèi)層干膜內(nèi)層干膜INNERLAYER IMAGE預(yù)迭板及迭板預(yù)迭板及迭板LAY- UP蝕蝕 銅銅I/L ETCHING鉆鉆 孔孔DRILLING壓壓 合合LAMINATION多層板內(nèi)層流程INNER LAYER PRODUCTMLBAO I 檢檢 查查AOI INSPECTION裁裁 板板LAMINATE SHEARDOUBLE SIDE雷雷 射射 鉆鉆 孔孔LASER ABLATIONBlinded ViaPCB Engineering Report Sheet4( 3 ) 外外 層層 制制 作作 流流 程程通 孔電鍍P . T . H .鉆 孔DRILLI

4、NG外 層 干 膜OUTERLAYER IMAGE二次銅及錫鉛電鍍PATTERN PLATING檢 查INSPECTION前 處 理PRELIMINARYTREATMENT二次銅電鍍PATTERN PLATING蝕 銅ETCHING全板電鍍PANEL PLATING外 層 制 作OUTER-LAYERO/L ETCHING蝕 銅TENTINGPROCESSDESMER除膠 渣E-LESS CU通孔電鍍前 處 理PRELIMINARYTREATMENT剝 錫 鉛T/L STRIPPING去 膜STRIPPING壓 膜LAMINATION錫鉛電鍍T/L PLATING曝 光EXPOSUREPCB

5、Engineering Report Sheet5液態(tài)防焊液態(tài)防焊LIQUID S/M外觀檢外觀檢 查查VISUAL INSPECTION成成 型型FINAL SHAPING檢檢 查查INSPECTION電電 測測ELECTRICAL TEST出貨前檢查出貨前檢查O Q C包包 裝裝 出出 貨貨PACKING&SHIPPING涂布印刷S/M COATING前 處 理PRELIMINARYTREATMENT曝 光EXPOSUREDEVELOPING顯 影POST CURE后 烘 烤預(yù) 干 燥PRE-CURE噴噴 錫錫HOT AIR LEVELING銅面防氧化處理O S P (Entek

6、Cu 106A)HOT AIR LEVELINGG/F PLATING鍍金手指鍍化學(xué)鎳金E-less Ni/Au印印 文文 字字SCREEN LEGEND選擇性鍍鎳鍍金SELECTIVE GOLD全面鍍鎳金GOLD PLATING( 4 ) 外外 觀觀 及及 成成 型型 制制 作作 流流 程程PCB Engineering Report Sheet6典型多層板制作流程典型多層板制作流程1. 內(nèi)層THIN CORE2. 內(nèi)層線路制作(壓膜)PCB Engineering Report Sheet7典型多層板制作流程典型多層板制作流程4. 內(nèi)層線路制作(顯影)3. 內(nèi)層線路制作(曝光)PCB En

7、gineering Report Sheet8典型多層板制作流程典型多層板制作流程5. 內(nèi)層線路制作(蝕刻)6. 內(nèi)層線路制作(去膜)PCB Engineering Report Sheet9典型多層板制作流程典型多層板制作流程7. 迭板8. 壓合LAYER 2LAYER 3LAYER 4LAYER 5LAYER 1LAYER 6PCB Engineering Report Sheet10典型多層板制作流程典型多層板制作流程9. 鉆孔10. 黑孔PCB Engineering Report Sheet11典型多層板制作流程典型多層板制作流程11. 外層線路壓膜12. 外層線路曝光PCB Eng

8、ineering Report Sheet12典型多層板制作流程典型多層板制作流程13. 外層線路制作(顯影)14. 鍍二次銅及錫鉛PCB Engineering Report Sheet13典型多層板制作流程典型多層板制作流程15. 去干膜16. 蝕銅(堿性蝕刻液)PCB Engineering Report Sheet14典型多層板制作流程典型多層板制作流程17. 剝錫鉛18. 防焊(綠漆)制造PCB Engineering Report Sheet15典型多層板制作流程典型多層板制作流程15. 浸金(噴錫)制造PCB Engineering Report Sheet16干干 膜膜 制制

9、作作 流流 程程基基 板板壓壓 膜膜壓膜後壓膜後曝曝 光光顯顯 影影蝕蝕 銅銅去去 膜膜PCB Engineering Report Sheet17典型之多層板迭板及壓合結(jié)構(gòu)典型之多層板迭板及壓合結(jié)構(gòu).COPPER FOIL 0.5 OZCOPPER FOIL 0.5 OZThin Core ,FR-4Thin Core ,FR-4prepregprepregCOMPCOMPS0LD.S0LD.prepregprepregThin Core ,FR-4Thin Core ,FR-4prepregprepregCOPPER FOIL 0.5 OZCOPPER FOIL 0.5 OZ迭合用之鋼板迭

10、合用之鋼板迭合用之鋼板迭合用之鋼板10-1210-12層迭合層迭合壓合機(jī)之熱板壓合機(jī)之熱板壓合機(jī)之熱板壓合機(jī)之熱板COPPER FOIL 0.5 OZCOPPER FOIL 0.5 OZThin Core ,FR-4Thin Core ,FR-4prepregprepregCOMPCOMPS0LD.S0LD.prepregprepregThin Core ,FR-4Thin Core ,FR-4prepregprepregCOPPER FOIL 0.5 OZCOPPER FOIL 0.5 OZ迭合用之鋼板迭合用之鋼板迭合用之鋼板迭合用之鋼板PCB Engineering Report Shee

11、t181.1.下料裁板下料裁板(Panel Size)(Panel Size)COPPER FOILCOPPER FOILEpoxy GlassEpoxy GlassPhoto ResistPhoto Resist2.2.內(nèi)層板壓干膜內(nèi)層板壓干膜( (光阻劑光阻劑) )PCB Engineering Report Sheet193.3.曝光曝光4.4.曝光后曝光后ArtworkArtwork( (底片底片) )ArtworkArtwork( (底片底片) )Photo ResistPhoto Resist光源PCB Engineering Report Sheet205.5.內(nèi)層板顯影內(nèi)層板顯

12、影Photo ResistPhoto Resist6.6.酸性蝕刻酸性蝕刻(Power/Ground(Power/Ground或或Signal)Signal)Photo ResistPhoto ResistPCB Engineering Report Sheet218.8.黑化黑化(Oxide Coating)(Oxide Coating)7.7.去干膜去干膜 ( Strip Resist) ( Strip Resist)PCB Engineering Report Sheet229.9.迭板迭板Layer 1Layer 1Layer 2Layer 2Layer 3Layer 3Layer 4

13、Layer 4Copper FoilCopper FoilInner LayerPrepreg(膠片)Prepreg(膠片)PCB Engineering Report Sheet2310.10.壓合壓合(Lamination)(Lamination)11.11.鉆孔鉆孔(P.T.H.(P.T.H.或盲孔或盲孔Via)Via)(Drill & (Drill & Deburr)Deburr)墊木板鋁板PCB Engineering Report Sheet2412.12.鍍通孔附著碳粉鍍通孔附著碳粉13.13.外層壓膜外層壓膜( (干膜干膜Tenting)Tenting)Phot

14、o ResistPCB Engineering Report Sheet2514.14.外層曝光外層曝光(pattern plating)(pattern plating)15.15.曝光后曝光后(pattern plating)(pattern plating)PCB Engineering Report Sheet2616.16.外層顯影外層顯影17.17.線路鍍銅及錫鉛線路鍍銅及錫鉛PCB Engineering Report Sheet2718.18.去去 膜膜19.19.蝕蝕 銅銅 ( (堿性蝕刻堿性蝕刻) )PCB Engineering Report Sheet2820.20.剝

15、錫鉛剝錫鉛21.21.噴涂噴涂( (液狀綠漆液狀綠漆) )PCB Engineering Report Sheet293.綠漆顯影綠漆顯影光源S/M A/WPCB Engineering Report Sheet3024.24.印文字印文字25.25.噴錫噴錫( (浸金浸金)R105WWEI94V-0R105WWEI94V-0PCB Engineering Report Sheet31光分解反應(yīng)光分解反應(yīng)( (正性工作正性工作) ) 底片底片,STENCIL(,STENCIL(網(wǎng)版網(wǎng)版) )PCB Engineering Report Sheet32光聚合反應(yīng)光聚合反應(yīng)(

16、(負(fù)性工作負(fù)性工作) ) 底片底片,STENCIL(,STENCIL(網(wǎng)版網(wǎng)版) )PCB Engineering Report Sheet33BURIED VIA LAY-UPBURIED VIA LAY-UPA = THROUGH VIA HOLE (導(dǎo)通孔導(dǎo)通孔)B = BURIED VIA HOLE (埋孔埋孔)C = BLIND VIA HOLE (盲孔盲孔 )D = BLIND HOLE MLB VIA (多層盲孔多層盲孔)BLIND VIA LAY-UPBLIND VIA LAY-UPBLIND VIA SEQUENTIAL LAY-UPBLIND VIA SEQUENTIAL LAY-UPA AB BB BA AC CC CA AR RE ES SI IN NB-STAGEB-STAGEBLIND AND BURIED VIA OPTION (BLIND AND BURIED VIA OPTION (盲盲 埋埋 孔孔 之之 選選 擇擇 ) )D DPCB Engineering R