深圳市福英達工業技術有限公司/一站式錫膏解決方案供應商SolderPasteJettingProcessIntroductionThejettingprocessisanemergingnon-contactsolderpastedepositiontechnologythatutilizesahigh-speedjettingvalvetospraytinysolderpastedropletsontothepadsofprintedcircuitboards(PCBs)toachieveon-demand,precisedepositionofsolderpaste.Theprincipleofthejettingprocessissimilartothatofaninkjetprinter.Bycontrollingthemovementofthenozzleandthefrequencyofthejetting,itispossibletoachievehigh-speed,high-precisionandhighlyflexiblesolderpastedeposition.Figure1.SolderpastejettingprocessTherearetwomaintypesoftraditionalsolderpasteapplicationprocesses:stencilprintingandsyringedispensing.Stencilprintingrequirestheuseofstenciltemplates,andtheprintingprocesstimeislong,lowflexibility,andisonlysuitableformassproduction;whilesyringedispensingrequirestheuseofairpressurecontrol,lowefficiency,theamountofsolderpasteisnoteasytocontrol,andhighcost.Comparedwiththesetwoprocesses,thejettingprocessofsolderpastehasthefollowingadvantages:1.Itcanrealizesmallersolderpastepointsandadapttofinerpadspacingtomeettheneedsofmicroelectronicpackaging.2.Highersolderpastedepositionspeedsforimprovedproductivity.3.Moreflexiblesolderpastedepositionmethods,suchasinthecavity,thetopofthecomponentorunevensurfaceforsolderpastedeposition.4.Savingtheamountofsolderpaste,reducingproductioncostandenvironmentalpollution.5.Avoidsomeproblemsinstencilprintingprocess,suchasunevenprintingofsolderpaste,solderpasteresidueandcleaning,stencilreplacementandmaintenance.Requirementsforsolderpasteinthejettingprocess1.GoodsphericityandnarrowparticlesizedistributionofsolderpowderTheuseofsolderpowderswithgoodsphericityandanarrowparticlesizedistributionisessentialinthejettingprocess.Goodsphericitymeansthatthesolderparticleshavearegularsphericalshape,whichisessentialtoensuresmoothpasteinjection.Theregularsphericalshapeoftheparticlesreducestheriskofneedlecloggingandensuresthecontinuousandstableoperationoftheproductionline.Inaddition,thenarrowparticlesizedistributionhelpstoimprovetheuniformityofthesolderpowder,ensuringthatthesizeofthesolderparticlesvarieslittlethroughoutthejettingprocess,thusimprovingtheconsistencyandcontrollabilityofthesolderpaste.2.GoodThixotropy,RheologyThixotropyreferstotheapplicationofforceorpressure,thepastecanquicklychangeitsshapetoadapttothemovementofthesprayheadandchange.Rheology,ontheotherhand,referstothepaste'sabilitytoflowwhenforceisapplied.Goodperformanceofthesetwopropertieshelpstoensurethatthesolderpastecanbesprayedsmoothlyanduniformlyduringtheproductionprocess,andbettercontrolofthesprayvolume,thusimprovingproductionefficiency.3.ModerateviscositypropertiesandgoodwettabilityViscosityisameasureofthefluidityofaliquid,andmoderateviscositycharacteristicsareessentialtomaintainthedotshapeofthepaste.Toohighaviscositymaycausethepastetobedifficulttodistributeuniformlyduringthejettingprocess,whiletoolowaviscositymayleadtoanunstablepastepointshape.Goodwettabilitymeansthatthesolderpasteadhereseffectivelytothesubstrateandsolderjoints,eliminatingdefectssuchaspull-tip.Byregulatingtheviscositycharacteristicsandwettabilityofthesolderpaste,thejettingprocesscanbeoptimizedtoensurethestabilityandconsistencyofsolderquality.FitechjettingsolderpasteJettingsolderpasteproducedbyFitechismadeofsolderpowderwithgoodsphericityanduniformparticlesizedistribution,smoothtindownwithoutblockingtheneedle,moderateviscosity,excellentwettingperformance,sui