Area:ReworkandRepair(返工和維修),,,,,,,,,,,,,,,,,,

No.,AuditCriterion,,Actual,,,,,,,,,,,,,,,Remark

,,"關鍵

(Y)","請記""X""字

(如果適用)",0,25,50,75,100,,,,,,Applicable,Sum,Valid,Total,

1.基本維修能力,,,,,,,,,,,,,,,,,,

1.1,維修工位是否相關的維修SOP?(SMT/AI/HI/組裝)修理人員是否有效執行?,Y,,,,,,,0,0,0,0,0,0,0,1,0,

1.2,SMT/AI/HI/組裝工序中的補料是否有補料流程或SOP?修理人員是否有效執行?,Y,,,,,,,0,0,0,0,0,0,0,1,0,

1.3,維修SOP中輔料有否定義焊錫(錫線)、助焊劑、清潔劑的型號/廠家/適用的客戶嗎?,,,,,,,,0,0,0,0,0,0,0,1,0,

1.4,有否明示說明不同部件的應用溫度及烙鐵嘴的尺寸?,,,,,,,,0,0,0,0,0,0,0,1,0,

1.5,維修工在更換無件之前，操作工有否用萬用表確認其數值或確認規格絲印?,,,,,,,,0,0,0,0,0,0,0,1,0,

1.6,"SMT補件的板是否按正常修理板流程處理?

(查找BOM→找物料→更換或補件前測量數值→補件→作補件標示和修理標示→記錄維修報表→單獨區分→單獨送檢→單獨轉后工序跟蹤)",,,,,,,,0,0,0,0,0,0,0,1,0,

1.7,SMT/HI維修SOP是否明確定義金手指元件被拆卸后是不可以再使用?證據?實際作業方式確認?,,,,,,,,0,0,0,0,0,0,0,1,0,

1.8,"SMT/HI維修SOP是否注明金手指元件/開關類元件假焊/連錫需補焊時,嚴禁使用熱風槍,必須進行烙鐵點焊?證據?實際作業方式確認?",Y,,,,,,,0,0,0,0,0,0,0,1,0,

1.9,SMT/HI維修SOP是否注明金手指元件的維修OK后的清洗方式?維修清洗如何避免液體的浸入?,Y,,,,,,,0,0,0,0,0,0,0,1,0,

1.10,帶接地片IC（QFN)的維修：是否遵循定位--→接地加熱焊接--→烙鐵托焊原則?證據?實際作業方式確認?,Y,,,,,,,0,0,0,0,0,0,0,1,0,

1.11,"HI維修工將補件的板修理OK后,是否在手補的HI元件上打點作標示?(便于檢查工位確認HI補件的方向極性是否正確)",,,,,,,,0,0,0,0,0,0,0,1,0,

1.12,"AI操作員是否在工作中發現拋料時需及時停機,在漏料的位置做標示,再繼續生產,帶整塊板打完AI后,進行補料?(適用于排序式AI)",,,,,,,,0,0,0,0,0,0,0,1,0,

1.13,"AI拋料的板給維修工維修時,拋料的位置是否依據BOM進行補料?",,,,,,,,0,0,0,0,0,0,0,1,0,

1.14,"AI維修工將補件的板修理OK后,是否在手補的AI元件上打點作標示?(便于檢查工位確認AI補件的方向極性是否正確)",,,,,,,,0,0,0,0,0,0,0,1,0,

1.15,對于金手指（鍋仔片）按鍵板的維修，是否必須帶手指套作業，不可以帶手套作業?,,,,,,,,0,0,0,0,0,0,0,1,0,

1.16,修理工是否接受過以上培訓?證據?,,,,,,,,0,0,0,0,0,0,0,1,0,

2.返工及維修管理,,,,,,,,,,,,,,,,,,

2.1,是否有返工流程文件?返工流程文件是否被審核批準?（抽檢不良/客戶反饋等品質異常返工）,,,,,,,,0,0,0,0,0,0,0,1,0,

2.2,電烙鐵溫度有否定期監控?(漏電流及溫度點檢),,,,,,,,0,0,0,0,0,0,0,1,0,

2.3,所有維修使用的烙鐵/電批有否接地?,,,,,,,,0,0,0,0,0,0,0,1,0,

2.4,維修區的物料是否有按客戶/供應商管理?,,,,,,,,0,0,0,0,0,0,0,1,0,

2.5,CHIP元件是否在料帶中保存?料帶外是否有物料編碼/規格型號?,,,,,,,,0,0,0,0,0,0,0,1,0,

2.6,IC類物料的是否存放在ESD防護盒中和原料帶/料盤中?,,,,,,,,0,0,0,0,0,0,0,1,0,

2.7,"IC的領用是否建立相關領用臺帳?不可以多領用,做備用.",,,,,,,,0,0,0,0,0,0,0,1,0,

2.8,"維修工使用的MSD元件必須在下班后退回到倉庫,由倉庫放入干燥箱中進行保管.",,,,,,,,0,0,0,0,0,0,0,1,0,

2.9,"AI補料使用的物料需從編帶上拆散,放入相應的有物料標簽的料盒中?(防止應物料盒太小,再次引腳變形拉伸,損壞元件)",,,,,,,,0,0,0,0,0,0,0,1,0,

2.10,是否有鑒別待維修的板及其維修OK待測試的板的分放?,,,,,,,,0,0,0,0,0,0,0,1,0,

2.11,每個維修位是否都有適當的調試設備?如：萬用表，示波器等?調試設備是否有校驗?,,,,,,,,0,0,0,0,0,0,0,1,0,

2.12,維修工位是否有使用視覺教具，工具作識別數值，位置及極性部件。,,,,,,,,0,0,0,0,0,0,0,1,0,

2.13,是否有用到最新的缐路圖?,,,,,,,,0,0,0,0,0,0,0,1,0,

2.14,維修品有序列號管理嗎?如維修報表/QC報表中有記錄不良品序列號(適合有序列號管理的組件),,,,,,,,0,0,0,0,0,0,0,1,0,

2.15,"在維修/不良分析工位,每件維修品被更換的元件是否清楚?都有被更換元件的記錄嗎?",,,,,,,,0,0,0,0,0,0,0,1,0,

2.16,"是否對維修品進行全檢,是否對數量/維修標示/工程更改狀態進行確認?",,,,,,,,0,0,0,0,0,0,0,1,0,

2.17,是否所有維修品都有維修“R”標示及外箱有單獨的維修標示?,,,,,,,,0,0,0,0,0,0,0,1,0,

2.18,維修品是否有單獨區分送OQA檢驗和出貨?,Y,,,,,,,0,0,0,0,0,0,0,1,0,

2.19,"維修中發現同一原因不良超過3PCS,是否有預警反饋上級領導?是否有相關分析改善措施?證據?是否所有的維修人員都知