1、C3日志正文PCB中英文術語護分享2011-05-2112:52a/w(artwork)底片ablation燒溶(laser)，切除abrade粗化abrasionresistance耐磨性absorption吸收acc(accept)允收acceleratedcorrosiontest加速腐蝕acceleratedtest加速試驗acceleration速化反應accelerator加速劑acceptable允收activator活化液activeworkinprocess實際在制品adhesion附著力adhesivemethod黏著法airinclusion氣泡airknife風刀amo

2、rphouschange不定形的改變amount總量amylnitrite硝基戊烷analyzer分析儀anneal回火annularring環狀墊圈;孔環anodeslime(sludge)陽極泥anodizing陽極處理aoi(automaticopticalinspection)自動:光學檢測applicabledocuments引用之文件aqlsampling允收水準抽樣aqueousphotoresist液態光阻aspectratio縱橫比(厚寬比)asreceived到貨時返回頂部backlighting背光back-up墊板bankedworkinprocess預留在制品base

3、material基材baselineperformance基準績效batch批betabackscattering貝他射線照射法beveling切斜邊;斜邊biaxialdeformation二方向之變形black-oxide黑化blankcontroller空缺對照組blankpanel空板blanking挖空blip彈開blister氣泡;起泡blistering氣泡blowhole吹孔board-thicknesserror板厚錯誤bondingplies黏結層bow;bowing板彎breakout從平環內破出bridging搭橋;橋接bto(buildtoorder)接單生產burn

4、ing燒焦burr毛邊(毛頭)返回頂部camcorder一體型攝錄放機carbide碳化物carlsonpin定位梢carrier載運劑catalyzing催化catholicsputtering陰極濺射法caulplate隔板;鋼板calibrationsystemrequirements校驗系統之各種要求centerbeammethod中心光束法centralprojection集中式投射線certification認證chamfer倒角(金手指)chamfering切斜邊;倒角characteristicimpedance特性阻抗chargetransferoverpotential電量

5、傳遞過電壓chase網框checkboard棋盤chelator蟹和劑chemicalbond化學鍵chemicalvapordeposition化學蒸著鍍circumferentialvoid圓周性之孔破cladmetal包夾金屬cleanroom無塵室clearance間隙coat鍍外表coatingerror防焊覆蓋錯誤coefficientofthermalexpansion(cte)熱澎脹系數coldsolderjoint冷焊點cold-weld金屬粉末冷焊color顏色colorerror顏色錯誤compensation補償competitiveperformance競爭力績效co

6、mplexsalt錯化物complexor錯化物componenthole零件孔componentside零件面concentric同心conformance密貼性consumerproducts消費性產品contactresistance接觸電阻continuousperformance連續發揮效能contractservice協力廠controlledsplit均裂式conventionalflow亂流方式conventionaltensiletest傳統張力測試法conversioncoating轉化層convex突出coordinatelist數據清單coppercladedlamin

7、ates(ccl)銅箔基板copperexposure線路露銅coppermirror鏡銅copperpad銅箔圓配copperresidue(coppersplash)銅渣corrosionratenumbering腐蝕速率計數系統corrosionresistance抗蝕性coulombslaw庫倫定律countersink喇叭孔coupon試樣couponlocation試樣點coveringpower遮蓋力cpu中心處理器crack破裂;裂縫crazing裂縫;白斑crosslinking交聯聚合crosstalk呼應作用crosslinking交聯crystalcollection結

8、晶收集curing聚合體currentefficiency電流效率cut-outs挖空cutting裁板cyanide氰化物cyclesoflearning學習循環cycle-timereduction交期縮短返回頂部datecode周期deburring往毛頭dedicated專用型degradation退變delamination分層dent/pinhole凹陷/*departmentofdefense國防部designation字碼簡示法de-smear除膠渣developing顯影dewetting縮錫dewettingtime縮錫時間dimensionerror外形尺寸錯誤diele

9、ctricconstant介質常數difficulty困難度difunctional雙功能dimension尺寸dimensionstability尺寸安定性dimensionalstability標準安定性dimensionandtolerance尺寸與公差dirtyhole孔內異物discolorhole孔黑;孔灰;氧化discoloration變色disposableeyeletmethod消耗性鉚釘法distortionfactor尺寸變形函數doubleside雙面板downtime停機時間drill鉆孔drillbit鉆頭drillfacet鉆尖切萷面drillpointer鉆尖重

10、(研)磨機drilledblankboard已鉆孔之*板drilling鉆孔dryfilm干膜ductility延展性返回頂部economyofscale經濟規模edgespacing板邊空地edge-boardcontact(goldfinger)金手指第12樓2006-11-121:38:59陸與臺灣pcb不同稱謂名詞術語對照aacceleration速化反應（臺）加速反應accelerator加速劑，速化劑（臺）促進劑，催化劑acceptablequalitylevel（aq1）允收品質水準（臺）合格質量水平accesshole露出孔，MarsMaple穿露孔（臺）余隙孔accuracy

11、正確度（臺）精確度aciddip浸酸（臺）弱酸蝕acrylic（resin）壓克力（臺）丙烯酸（樹脂）activeparts主動零件（臺）有源器件anisotropicconductivefilm（adhesive）單向導接著膜（臺）單向導電膜anneal韌化（臺）退火anylayerinterstitialviahole（alivh）阿力制程（臺）全層內部導通孔，任意層內部通孔areaarraypackage面積格列封裝（臺）面陣列封裝bballgridarray球腳陣列（臺）球柵陣列bandability可彎曲性（臺）可撓性bandwidth頻帶寬度，頻寬（臺）帶寬bankingagent

12、護岸劑（臺）護堤劑bareboard空板，未裝板（臺）*板barechipassembly*體芯片組裝（臺）*芯片安裝basicgrid基本方格（臺）基本網絡blanking行空斷開（臺）落料bleeding滲流（臺）滲出blockdiagram電路系統整合圖（臺）方塊框圖blotting干印（臺）吸墨blowhole吹孔（臺）氣孔bondstrength結合強度，固著強度（臺）粘合強度bondability結合性，固著性（臺）粘合性bondingsheet（ply，layer）接合片，接著層（臺）粘結片bondingwire結合線（臺）鍵合線brazing硬焊（臺）釬焊breakawaypa

13、nel可斷開板（臺）可斷拼板breakdownvoltage崩潰電壓（臺）擊穿電壓brightdip光澤浸漬處理（臺）浸亮build-up增厚，堆積，增層（臺）積層build-upmultiayer（bum）增層法多層板（臺）積層法多層板burr毛頭（臺）毛剌busbar匯電桿（臺）匯流排ccaplaminaton帽式壓正當（臺）覆蓋層壓法cavitydown/cavityup方凹區朝下/方凹區朝上（臺）空腔區朝下/空腔區朝上cellphone行動電話（臺）移動電話chase網框（臺）網框chemicalresistance抗化性，耐化性（臺）耐化學性chip芯片，晶粒，片狀（臺）芯片chip

14、onboard（cob）晶板接裝法（臺）載芯片板chipscalepackage芯片級封裝（臺）芯片級安裝circumferentialseparation環狀斷孔（臺）環開斷裂clad/cladding披覆（臺）覆箔clinchedleadterminal緊箱式引腳（臺）折彎引腳clokfrequency時脈速率（臺）時鐘頻率coaxialcable同軸纜線（臺）同軸電纜coldsolderjoint冷焊點（臺）虛焊點comparativetrackingindex比較性漏電指數（臺）相比起痕指數complexion錯離子（臺）絡離子componenthole零件孔（臺）組件孔compone

15、ntside組件面（臺）組件面condensationsoldering凝熱焊接，液化放熱焊接（臺）冷凝焊接conductiveanodicfilament玻纖紗式漏電（臺）陽極性玻纖絲的漏電conductorspacing導體間距（臺）導線間距core（board）核心板，核板（臺）芯板corematerial內層板材，核材（臺）內層芯材cornercrack通孔斷角（臺）拐角裂縫cornermark板角標記（臺）拐角標記counterboring垂直向下擴孔，埋頭孔（臺）沉頭孔countersinking錐型擴孔，喇叭孔（臺）錐形孔couplingagent耦合劑（臺）偶聯劑coupon，

16、testcoupon板邊試樣（臺）附連測試板coverlayer，coverlay表護層（臺）覆蓋層crease皺折（臺）折痕creep潛變（臺）蠕變crosshatching十字交叉區（臺）開窗口crossover越交，搭交（臺）跨交crosstalk雜訊，串訊（臺）串擾cure硬化，熟化（臺）固化，硫化current、LeGrandCrosscarryingcapability載流能力（臺）載流量curtaincoating濂涂法（臺）簾幕法ddaisychaining菊花瓣連墊（臺）串推deburring往毛頭（臺）往毛剌definition邊沿*真度（臺）清楚度denier丹尼爾（臺）

17、坦尼爾dent凹陷（臺）凹坑deposition沉積，附積（臺）沉積desmearing除膠渣（臺）往鉆污dewetting縮錫（臺）半潤濕diazofilm偶氮棕片（臺）重氮底片dicing芯片分割（臺）切片dieattach晶粒安裝（臺）管芯安裝diebonding晶料接著（臺）管芯鍵合dielectricbreakdown介質崩潰（臺）介質擊穿dielectriebreakdownvoltage介質崩潰電壓（臺）介質擊穿電壓dielectricconstant,dkors介質常數（臺）介電常數differentialscanningcalorimetry（dsc）微差掃瞄熱卡分析法（臺）

18、示掃描量熱法dimensionalstability標準安定性（臺）尺寸穩定性direct/indirectstencil直間版膜（臺）直接/間接法網版discretecomponent散裝零件（臺）離散組件disspationfactor（df）散失因素（臺）損耗因素drillfacet鉆尖切削面（臺）鉆尖切削面dualwavesoldering雙波焊接（臺）雙波峰焊dynamicflex（fpc）動態軟板（臺）動態撓性板dynamicmechanicalanalysis（dma）動態熱機分析法（臺）動態力學分析法，熱機械分析法eeddycurrent渦電流（臺）渦流edge-boardco

19、nnector板邊（金手指）承接器（臺）板邊連接器edge-boardcontact板邊金手指（臺）板邊插頭edgespacing板邊空地，邊寬（臺）邊距edta乙=胺四醋酸（臺）乙=胺四乙酸electricstrength（耐）電性強度（臺）電氣強度electro-depositedphotoresist電著光阻，電泳光阻（臺）電沉積光致抗蝕劑electrolessdeposition無電鍍，化學鍍（臺）無電電鍍，化學鍍，非電解電鍍electro-phoresis電泳動，電滲，電子構裝（臺）電泳etchback回蝕（臺）凹蝕陰影etchfactor蝕刻因子，蝕刻函數（臺）蝕刻系數etchin

20、gindicator蝕刻指標（臺）蝕刻指示圖etchingresist抗蝕阻劑（臺）抗蝕刻euteticcomposition共融組成（臺）共晶組成excimerlesar準分子雷射（臺）準分子激光ffacebonding晶面朝下之結合（臺）倒芯片鍵合fatinguestrength抗疲憊強度（臺）疲憊強度fibetexposure玻織顯露（臺）露纖維fiducialmark基準記號，光學靶標（臺）基準標記filmadhesive接著膜，粘合膜（臺）粘結膜finepitch密腳距，密線距，密墊距（臺）精細節距ggatearray閘機陣列，閘列（臺）門陣列geltime膠性時間（臺）膠化時間，凝

21、膠時間gelationparticle膠凝點（臺）凝膠點ghostimage陰影（臺）重影glasstransitiontemperature，tg玻璃態轉化溫度（臺）玻璃化溫度，玻璃態轉變溫度grid標準格（臺）網格gridwinglead（臺）契形引線（腳）hhalation環暈（臺）暈環haywire跳線（臺）附加線holdingtime停置時間（臺）停留時間holebreakout孔位破出（臺）破壞holedensity孔數密度（臺）孔密度holepullstrength孔壁抗拉強度（臺）孔拉脫強度holevoid破洞（臺）孔壁空洞holeairsoldrtlevelling（hasl

22、）噴錫（臺）熱風整平hullcell哈爾槽（臺）霍爾槽iicicle錫尖（臺）焊料毛剌imaging成像處理（臺）成像imperegnate含浸（臺）浸漬informationappliance（ia）資訊家電（臺）信息家電integratedcircuit（ic）積體電路器（臺）集成電路inte*ce接口（臺）界面jj-leandj型接腳，彎鉤型腳（臺）j形引線jumpwire跳線（臺）跨接線kkapton聚亞酰胺軟材（臺）聚酰亞胺薄膜kisspressure吻壓，低壓（臺）接能壓力knowngooddie（kgd）已知之良好芯片（臺）已知好芯片smtlover2003-06-0803:37

23、llaminarflow平流（臺）層流laminate（s）基板、LapDancingCat積層板（臺）層壓板land孔環焊墊，表面（方型）焊墊（臺）連接盤，焊盤landgridarray（lga）承墊（臺）連接盤，焊盤landlesshole無環通孔（臺）無連接盤導通孔，無焊盤導通孔laserablation雷射燒蝕，雷射成孔（臺）激光成孔leadpitch腳距，中距，跨距（臺）引腳節距leakagecurrent漏電電流（臺）漏電流legend文字標記，符號（臺）字符liftedland孔環（或焊墊）浮起（臺）連接盤起翹ligand錯離子附屬體（臺）內層配位體liquidphotoimag

24、iblesoldermask，lpsm液態感光防焊綠漆（臺）液體光致辭阻焊劑losstangent（tan5dk）損失正切（臺）介質損耗角壓切，介質損耗因數masterdrawing主圖（臺）布設總圖mat墊（臺）氈mealing泡點（臺）粉點measling白點（臺）白斑meniscographtest弧面狀沾錫試驗（臺）變口試驗metalcoreboad金屬夾心板（臺）金屬芯（印制）板minimumannularring孔環下限（臺）最小環寬minimumelectricalspacing下限電性間距，最窄電性間距（臺）最小電氣間距mixedcomponentmountingtechnol

25、ogy混合零件之組裝技術（臺）混安裝技術modem調變及解調器，數據機（臺）調制-調解器module模組（臺）模件、組件、模塊moistureandinsulationresistancetest濕氣與盡緣電阻試驗（mir）（臺）潮熱盡緣電阻試驗montinghole組裝孔，機裝孔（臺）安裝孔nnumericallycontrolled（n.c.）數值控制（臺）數控negative復片，鉆尖第一面外緣變窄（臺）負像negative-actingresist負性作用之阻劑，負型阻劑（臺）負性抗蝕劑negativeetchback反回蝕（臺）負凹蝕n-methylpyrrolidone（nmp）n

26、-甲基四氫吡咯（臺）n-甲基吡咯烷酮nodule瘤（臺）結瘤noisebudget雜訊上限（臺）最大雜音，最大噪聲nominalcuredthickness標示厚度（臺）標稱厚度non-wetting不沾錫（臺）不潤濕nylon耐龍（臺）尼龍ooff-contact排擠（臺）非接觸（印刷）offset第一面大小不均（臺）鉆面不勻outerleadbond(olb)外引腳結合（臺）外部引線粘接oligomer寡聚物（臺）低聚物outgassing出氣，吹氣（臺）逸氣outgrowth懸出，橫出，側出（臺）鍍層情況overhang總浮空（臺）鍍層突出overpotential過電位，過電壓（臺）趨

27、電勢ppanelplating全板鍍銅（臺）整板電鍍passivedevice（component）被動組件（零件）（臺）無源組件patternplating線路電鍍（臺）圖形電鍍pattenprocess線路電鍍法（臺）圖形電鍍法peelstrength抗撕強度（臺）剝離強度permittivity容電率（臺）電容率，介電常數phototinitator感光啟始劑（臺）光敏劑pin接腳，插稍冬插針（臺）管腳pingridarray（pga）針腳格列封裝體（臺）針柵陣列pitch跨距，腳距，墊距，線距，中距（臺）節距pits凹點（臺）麻點plasma電漿（臺）等離子plastic-bga（pb

28、ga）塑膠質球腳封裝體（臺）塑料球柵陣列platen熱盤（臺）加熱板plug插腳，塞柱（臺）插頭，插銷polarizingslot偏槽（臺）偏置定位槽porositytest疏孔度試驗（臺）孔隙率試驗positiveactingresist正型光阻劑（臺）正性抗蝕劑prepreg膠片，樹脂片（臺）粘結片，半固化片processcamera制程用照相機（臺）制版照相機purge，purging凈空，凈洗（臺）洗凈smtlover2003-06-0803:38qquadflatpack（qfp）方扁形封裝體（臺）扁平方型封裝臺）質qualityconformancetestciruitry（cou

29、pon）品質符合之試驗線路（樣板）量一致檢驗電路rreflowsoldering重熔焊接，熔焊（臺）再流焊registermark對準作標記（臺）對準標記registration對準度（臺）重合度reinforcement補強材（臺）增強材料relamination（re-lem）多層板壓合（臺）多層板壓制relativepermitivity（s）相對容電率（臺）相比介電常數resincoatedcopperfoil背膠銅箔（臺）涂樹脂銅箔，附樹脂銅箔resinflow膠流量，樹脂流量（臺）樹脂活動度resinrecession樹脂縮陷（臺）樹脂凹縮resinricharea樹脂豐富區，多膠

30、區（臺）樹脂鉆污resinstarvedarea樹脂缺乏區，缺膠區（臺）缺膠區resist阻劑，阻膜（臺）抗蝕劑resolution解像，解像變，解析度（臺）分辨率reverseimage負片影像（阻劑）（臺）負圖像rigid-flexprintedboard硬軟合板（臺）剛撓印制板ring套環（臺）鉆套ripple紋波（臺）波動，脈動rollercoating滾筒涂布法、AlltheLittlethings輥輪涂布法（臺）輥涂式sscratch刮痕（臺）劃痕secondaryside第二面（臺）輔面immolation-alignment自我回正（臺）自定位shadowing陰影，回蝕死角（

31、臺）凹蝕陰影shearstrength抗剪（力）強度（臺）剪切強度silverfhroughhole（sth）銀膠通孔，銀膠貫孔（臺）銀漿通孔，銀漿貫孔single-inlinepackage（sip）單邊插腳封裝體（臺）單列直插式封裝solderconnection焊接點（臺）焊點solderpaste錫膏（臺）焊膏solderplug錫塞，錫柱（臺）焊料堵塞solderspreadteat散錫試驗（臺）焊料擴展試驗solderwebbing錫網（臺）網狀殘錫soldering軟焊，焊接（臺）軟釬焊，焊接solidcontent固體含量，固形份，固形物solubilityproduct溶解度

32、乘積，溶解度積（臺）容度積splay斜鉆孔（臺）斜孔spraycoating噴著涂裝，噴射涂裝（臺）噴涂stencil片膜（臺）漏板，模版stringing拖尾，牽絲（臺）帶狀線stripper剝除液，剝除器（臺）剝離液supportedhole（金屬）支助通孔（臺）支撐孔su*cemountingtechnology表面貼裝技術（臺）表面安裝技術surge突流、突壓（臺）波動swagedlead壓扁式引腳（臺）擠壓引線syringe擠漿法，擠膏法，注漿法（臺）注射法ttab接點，金手指（臺）印制插頭telegraphing浮印，隱印（臺）露印template模板（臺）*模板tensilest

33、rength抗拉強度（臺）拉伸強度，抗拉強度vterminal端子（臺）端接（點）thermalconductivity導熱率（臺）熱導率thermalshocktest熱震蕩試驗（臺）熱沖擊試驗thermogravimetricanalysis（tga）熱重分析法（臺）熱解重量分析法thermosonicbonding熱超音波結合（臺）熱聲連（焊）接thermount聚醯胺短織席材（臺）聚酰胺纖維無紡布thinsmalloutlinepackange（tsop）薄小型積體電路器（臺）薄小外形封裝thixotropy抗垂流性，搖變性，搖溶性，靜凝性（臺）觸變性tinindicated浸鍍錫（臺

34、）浸錫totalindicatedrunout（tir）總體標示偏轉值（臺）指針總讀數touchup觸修，簡修，小修，（臺）修版transferbump移用式突塊，轉移式突塊（臺）變換凸塊treament，trearing含浸處理（臺）浸漬twist板翹、SkyHighFire板扭（臺）扭曲uutimatetensilestrength（uts）極限抗拉強度（臺）極限拉伸強度ultravioletcuring（uvcuring）紫外線硬化（臺）紫外線固化ultrasonicbonding超音波結合（臺）超聲連接unbalanedtransmissionline非平衡式傳輸線（臺）非均衡傳輸線u

35、nsupportedhole非鍍通孔（臺）非支撐孔urethane胺基甲酸乙脂（臺）氨基甲酸乙酯v-cutv型切槽（臺）v槽切割vacuumevaporation（ordeposition）真空蒸鍍法（臺）真空鍍膜法vacuumlamination真空壓合（臺）真空壓制varnish清漆，凡力水（臺）樹脂漆visualexamination（inspection）目視檢查（臺）目檢voltagebreakdown（崩）潰電壓（臺）擊穿電壓voltageplaneclearance電壓層的空環（臺）電源層隔離wwaviness波紋、波度（臺）云織weaveexposure織紋顯露；weavete

36、xture織紋隱現（臺）露布紋wedgevoid楔形缺口（破洞）（臺）楔形空洞wetlamination濕壓膜法（臺）濕法貼膜wetting沾濕、沾錫（臺）焊料潤濕wicking燈芯效應（臺）芯吸wirebonding打線結合（臺）金屬絲連接workingmaster工作母片（臺）工作原版wrinkle皺褶，皺紋（臺）皺褶zzigzaginlinepackage（zip）鏈齒狀雙排腳封裝件（臺）彎曲式直插封裝此貼子已經被作者于2006-9-2121:58:14編輯過第13樓2006-11-121:39:00線路板流程術語中英文對照流程簡介：開料鉆孔干膜制程壓合減銅電鍍塞孔防焊(綠漆/綠油)鍍金

37、噴錫成型開短路測試終檢雷射鉆孔開料(cutlamination)a-1裁板(sheetscutting)a-2原物料發料(panel)(shearmaterialtosize)鉆孑L(drilling)b-1內鉆(innerlayerdrilling)b-2一次孑(outerlayerdrilling)b-3二次孑(2nddrilling)b-4雷射鉆孑(laserdrilling)(laserablation)b-5盲(埋)孑鉆孑(blind&buriedholedrilling)干膜制程(photoprocess(d/f)c-1前處理(pretreatment)c-2壓膜(dryfilml

38、amination)c-3曝光(exposure)c-4顯影(developing)c-5蝕銅(etching)c-6往膜(stripping)c-7初檢(touch-up)c-8化學前處理,化學研磨(chemicalmilling)c-9選擇性浸金壓膜(selectivegolddryfilmlamination)c-10顯影(developing)c-11往膜(stripping)developing,etching&stripping(des)壓合laminationd-1黑化(blackoxidetreatment)d-2微蝕(microetching)d-3鉚釘組合(eyelet)d

39、-4疊板(layup)d-5壓合(lamination)d-6后處理(posttreatment)d-7黑氧化(blackoxideremoval)d-8銃靶(spotface)d-9往溢膠(resinflushremoval)減銅(copperreduction)e-1薄化銅(copperreduction)電鍍(horizontalelectrolyticplating)f-1水平電鍍(horizontalelectro-plating)(panelplating)f-2錫鉛電鍍(tin-leadplating)(patternplating)f-3低于1mil(lessthan1milt

40、hickness)f-4高于1mil(morethan1milthickness)f-5砂帶研磨(beltsanding)f-6剝錫鉛(tin-leadstripping)f-7微切片(microsection)塞孔(plughole)g-1印刷(inkprint)g-2預烤(precure)g-3表面刷磨(scrub)g-4后烘烤(postcure)防焊(綠漆/綠油):(soldermask)h-1c面印刷(printingtopside)h-2s面印刷(printingbottomside)h-3靜電噴涂(spraycoating)h-4前處理(pretreatment)h-5預烤(pre

41、cure)h-6曝光(exposure)h-7顯影(develop)h-8后烘烤(postcure)h-9uv烘烤(uvcure)h-10文字印刷(printingoflegend)h-11噴砂(pumice)(wetblasting)h-12印可剝離防焊(peelablesoldermask)i.鍍金goldplatingi-1金手指鍍鎳金(goldfinger)i-2電鍍軟金(softni/auplating)i-3浸鎳金(immersionni/au)(electrolessni/au)j.噴錫(hotairsolderleveling)j-1水平噴錫(horizontalhotairsolderleve