PHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO1元件吃錫效果與PCBLayout關系PHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO2進板方向GOOD1.TWOSMDTOOCLOSE2.SMT本體易產生陰影效應8JES326S.0A3PCB進板方向PHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO3光學點反黑範圍太小此光學點可以不用LAYOUT8JES326S.0A3PCB光學點太小PHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO4光學點為土黃色,黑色佳8JES326S.0A3PCB光學點顏色PHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO5陰影效應8JES326S.0A3PCB陰影效應進板方向LAYOUT請註明進板方向PHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO6GOOD(BIGPAD)8JES326S.0A3PCBBIGPADPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO7太密易造成短路沒拖錫點LAYOUT8JES326S.0A3PCBCONNECTERSHORTPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO88JES326S.0A3PCB正板零件容易被破壞或掉件熱氣會由貫穿孔往上衝PTH&PADTOOCLOSEPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO98JES326S.0A3PCB加白點有助減少short缺點,最好加一白線加白漆防焊(文字印刷)PHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO108JES326S.0A3PCBPhonejack和SMD太近且SMTcomponent太近易短路現象發生進板方向PAD&PADTOOCLOSEPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO118JES326S.0A3PCB光學點離pad太近(BGA會打不準)光學點&PADTOOCLOSEPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO12S1024B.5A18EPCB節省工時可使用吃錫螺絲吃錫螺絲PHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO13S1024B.5A18EPCB增加拖錫點避免短路發生

進板方向LAYOUT請註明進板方向增加拖錫點防止短路沒有作用的拖錫點增加拖錫點避免短路發生

沒有作用的拖錫點PHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO14S1024B.5A18EPCBSOLDERSIDEIC容易短路IC最好LAY在正板或以45°LAYOUT較不易造成PIN腳短路否則需用昂貴治具COVERICONSOLDERSIDELAYOUTDIRECTIONPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO15S1024B.5A18EPCB不要利用螺絲孔接地PAD&SCREWHOLEGROUNDINGPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO16S1024B.5A18EPCBVIA

hole綠漆應蓋solderside避免錫珠掉在VIAHOLE造成零件問題(翹件、空焊)SOLDERMASKONSOLDERSIDEONLYPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO17S1024B.5A18EPCB以馬賽克LAYOUT方式較好(熱平衡)DUMMYPADPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO18防焊防止PTH拉錫PHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO19TOOCLOSE容易SHORTCOMPONENTTOOCLOSEPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO20電容容易FAILPTH熱氣會沖上來吃錫不好銅箔太大,散熱太快SOLDERNOTENOUGHPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO21容易SHORT吃錫後外觀不良???EASYSHORTPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO22陰影效應PHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO23拖錫棒避免SOCKETSHORT拖錫棒進板方向LAYOUT請註明進板方向PHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO24避免CONNECTORSHORT假的pad拖錫用

進板方向LAYOUT請註明進板方向拖錫棒設計方向PHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO25進板方向Layout沒考量進板方向,假pad放錯邊SOLDERDIRECTIONPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO26此處淚滴(TEARDROP)設計較好,狗骨頭(DOGBONS)不好DOGBONSPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO27不好的接地SCREWHOLE&SMDPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO28goodNogoodSCREWHOLEPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO29不好的layout吃錫易不足散熱快goodHEATTRANSFERPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO30測試點layoutTESTPOINTPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO31過Wavesolder時電解質電容容易遭熱氣上沖而Fail電容易被熱氣沖壞PHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO32BGALAYOUT:DOGBONSBETTERTHANTEARDROPDogboneVsTeardropPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO33背板拖錫棒拖錫進板方向PHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO34測試點LAYOUT方式TESTPOINTPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO35WAVESOLDERPROFILEPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO36AssemblyPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO37SMTProcessFlowPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO38SMTProcessFlowPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO39SMTProcessFlowPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO40SMTProcessFlowPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO41SMTProcessFlowPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO42WavesolderingProfilePHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO43MachinesetupandprocesscharacteristicsBoard/wavecontactlengthBoarddwelltimeinsolderwave(s)Boardimmersiondepthinwaves(s)ConveyorspeedConveryortowaveorientationPreheattemperatureslopeMaxpreheattemperatureTemperaturespikeatthewave(s)Soldertemperatureinthewave(s)TimeaboveliquidusPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO44IRReflowSolderprofilePHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO45VaporPhasereflowsolderProfilePHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO46PreheatingToreducethermalshocktoPWBfromsolderwaveToactivethefluxbyheatingit.Todrythefluxwhichwouldotherwiseboilduringsoldering,causingsolderballs.Topreventtheboardwarpingduringsoldering.PHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO47StencilPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO48KeypointofProcess(1)ConveyorspeedBoardspollutionDwelltimeSoldertemperatureSolderpotcontaminationTypeoffluxFluxcontaminationFluxfoamedunevenPreheatertemperatureSolderwaveunevenComponentscontaminationBoardsoxidedBoardsre-runDefectivefixtureFluxBlow-off(airknife)excessiveFluxnotmakingcontractBoardsnotseatedrightFluxfoamedlowFluxspecificgravityPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO49KeypointofProcess(2)IncorrectfluxbubblesizeImproperboardhandlingSolderwaveturbulentFluxnolongeractivePalletdesignDefectivemaskmaterialsInternalplanes(Multilayer)LargeplanesonsoldersidePallettoohotTypeofcoatingBoardwrappedFluxBlow-off(airknife)notonIncorrectweightplacementMisregistrationofmaskBasematerial(epoxyresin)PHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO50DefectandCounterdefectForcePHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO51DrawbridgePHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO52ConveyoranglePHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO53Solderjointfail

ResidualplatingchemicalsIncompletecleaningafterplatingSurfacecontaminationSurfaceoxidationPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO54SOLDERBUMPING:VOIDING1.solventsinthefluxsystemunabletodiffusethroughthemoltensolderduringreflow2.alloyshrinkageoncooling3.jointshape-thepathofescapeforvaporscanbedifficultandleadtoentrappedgases4.improperornon-optimizedheatingprofile5.platingorsoldermaskrelatedissues(outgassing,inadequatecleaning,etc.)6.typeofsolderpasteandpowdersizeusedPHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO55印刷電路板方向不當 尺寸設計不良 未置於定位 有異物或受污染受重壓寬幅不當保護層處理不當印刷電路板或零件過期及儲存不當重量分佈不當氧化破損插件面設計不良載重過多變形焊錫面設計不良多層板內電路設計不良PHOTOBYQC/WONDERNOTEDBYMED/STEVENKUO56印刷電路板印刷油墨不良 過量印刷油墨印刷油墨未稱位抗焊印刷不良 抗焊印刷不夠貼合層內有濕氣不完全蝕刻 不良穿孔 空洞太大環氧